Sector
Upstream supply chain and electronic components
PCBs, SMD components and critical metals: map your tier 1 and tier 2 suppliers, anticipate obsolescence and geographic dependency.
- Multi-tier component mapping
- Obsolescence and allocation risk
- Critical minerals and compliance
Finished product sheet
Assembled electronic board
On the right: the finished-product sheet. On the image: each point is a component that feeds this completeness.
Hover a component on the product to read its sheet.
Multilayer PCB
Supplier · BoardTech · 80/100
Supply : BoardTech : couverture matière, lead time et capacité lus sur la position supply. Critères : IPC Class, Lead time.
Performance : BoardTech : score 80/100 sur la matière. Lecture spider Approvisionnement (OTIF, qualité, délais) et risques associés.
RoHS : Déclaration RoHS PCB compliant. SCIP : Données SVHC stratifiées to strengthen.
Component carbon
À surveiller0,28 kg CO₂e
SMD components
Supplier · ChipSource · 65/100
Supply : ChipSource : couverture matière, lead time et capacité lus sur la position supply. Critères : Allocation, Counterfeiting.
Performance : ChipSource : score 65/100 sur la matière. Lecture spider Approvisionnement (OTIF, qualité, délais) et risques associés.
RoHS : SMD sous seuils substances restreintes. Conflict Minerals : CMRT étain : traçabilité fonderie under watch. SCIP : Risque allocation / contrefaçon : SVHC article to complete.
Component carbon
Action requise0,32 kg CO₂e
Electrolytic copper
Supplier · CuivrePro · 87/100
Supply : CuivrePro : couverture matière, lead time et capacité lus sur la position supply. Critères : Purity, LME price.
Performance : CuivrePro : score 87/100 sur la matière. Lecture spider Approvisionnement (OTIF, qualité, délais) et risques associés.
Conflict Minerals : Couverture données amont cuivre partielle. DPP : Champs passeport partiels sur l'amont cuivre.
Component carbon
Sous l'objectif0,26 kg CO₂e
Tin
Supplier · TinGlobal · 79/100
Supply : TinGlobal : couverture matière, lead time et capacité lus sur la position supply. Critères : Conflict-free, Purity.
Performance : TinGlobal : score 79/100 sur la matière. Lecture spider Approvisionnement (OTIF, qualité, délais) et risques associés.
Conflict Minerals : Conflict-free déclaré. Dépendance Asie under watch. RoHS : Étain d'apport compliant RoHS.
Component carbon
À surveiller0,28 kg CO₂e
Epoxy resin
Supplier · EpoxyChem · 83/100
Supply : EpoxyChem : couverture matière, lead time et capacité lus sur la position supply. Critères : Tg, REACH.
Performance : EpoxyChem : score 83/100 sur la matière. Lecture spider Approvisionnement (OTIF, qualité, délais) et risques associés.
REACH : Résine sans SVHC bloquante. Tg déclarée. CLP : FDS résine up to date.
Component carbon
Sous l'objectif0,27 kg CO₂e
Connectors
Supplier · ConnexIO · 78/100
Supply : ConnexIO : couverture matière, lead time et capacité lus sur la position supply. Critères : RoHS, Qualification.
Performance : ConnexIO : score 78/100 sur la matière. Lecture spider Approvisionnement (OTIF, qualité, délais) et risques associés.
RoHS : Connecteurs déclarés RoHS. CE marking : Preuves CEM / basse tension rattachées. WEEE : Catégorie EEE documented.
Component carbon
À surveiller0,28 kg CO₂e
Assembled electronic board
8/8 components and materials mapped through tier 2
Finished product sheet
Assembled electronic board
The board is only validated with RoHS, Conflict Minerals, SCIP, WEEE, REACH and CE marking in one place.
4 components under watch. The product sheet aggregates component readings.
4 components under watch. The product sheet aggregates component readings.
4 components under watch. The product sheet aggregates component readings.
Product carbon impact
Under watch2.6kg CO₂e
PCF · per board · cradle-to-gate
PCF for PCB, SMD and metals. Upstream fab data coverage still partial on copper.
Product compliance frameworks
- RoHSWithin limits
RoHS declarations on PCB, connectors and assembly. No restricted substance above threshold.
- Conflict MineralsUnder watch
Upstream tin and copper CMRT documented. Smelter traceability under watch.
- SCIPUnder watch
Full BOM, but SMD components at allocation risk. Article SVHC data to strengthen.
- WEEEDocumented
EEE category and producer-responsibility scheme membership documented for the assembled board.
- CE markingDoC available
DoC and EMC / low-voltage evidence available for the reference.
- DPPTo complete
Composition and metals mapped. Passport fields still partial on fab upstream.
Material cascade
From finished product to every upstream material: electronics
Mapping example: every material is evaluated by the buyer on compliance, capacity, traceability and supply risk.
Finished product
Assembled electronic board
Reference, sourcing validated
Multilayer PCB
BoardTech
SMD components
ChipSource
Electrolytic copper
CuivrePro
Tin
TinGlobal
Epoxy resin
EpoxyChem
Connectors
ConnexIO
Silicon wafer
WaferFab
← SMD components
Copper cathode
MineCuivre
← Electrolytic copper
Finished product
Starting point: the processed product and its material bill of materials.
Materials & components
Every critical reference linked to its supplier and its evidence.
Upstream links
Tier 1 and tier 2 mapped: origin, capacity, single-source risk.
Consolidated status
Compliance, risk and material coverage read at the product chain level.
Manage your material purchasing in electronics
Supplier qualification, incoming COA and upstream cascade: one platform to secure your production.
Already a client? Buyer portal · Supplier portal